Antistatic Emboss Spacers are protective packaging materials designed for semiconductor, driver IC and electronic packaging processes. Used in conjunction with carrier tape/reel, they use the wave-like structure of the bubbles to buffer and space electronic components, while also providing antistatic protection to protect sensitive components from electrostatic discharge (ESD) damage.
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Industrial consumables made from polyimide film (PI) as the substrate through precision die-cutting. They play a crucial role in modern electronics manufacturing, primarily used in IC packaging, COF (Chip on Film) packaging, and other processes.
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Typically combined in semiconductor testing and electronics manufacturing, these products form "pogo pin trays," which are mainly used to protect, organize, and transport precision and expensive test pogo pin.
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