Driver IC COG trays manufactured with special anti-static materials, combined with high-precision molding technology to ensure flat and stable chip placement, perfectly compatible with various IC processes.
Learn MoreA conductive HIPS Chip tray is a plastic packaging carrier widely used in semiconductor packaging and testing, and electronic component packaging. It is made of high-impact resistant polystyrene (HIPS) mixed with conductive carbon black or carbon fiber, and has good antistatic and conductive properties to protect precision wafers from electrostatic damage (ESD) and physical impacts.
Learn MoreModified materials with antistatic agents added to polycarbonate (PC) substrates can effectively prevent static electricity accumulation and are more suitable for static-sensitive environments than ordinary PC plastics. Special antistatic materials have high toughness, impact strength and heat resistance. Combined with Chin Hui's high-precision molding technology and high-cleanliness dust removal equipment, they provide flat and stable load-bearing functions.
Learn MoreThe carrier tray, developed to meet the needs of carrying microchips or passive components, is made of special antistatic ABS or conductive HI-PS material, which micro-chip cavity made by high-precision molding technology, controlled by high-specification warpage requirements, and is dusted by high-cleanliness HEPA equipment, providing a high-quality tray that perfectly fulfill the microchip and prevents chip jumping during transportation.
Learn MoreChip Tray Clip is an accessory used to secure and protect IC chip trays, ensuring that chips do not jump or fall off due to vibration during packaging, testing, and transportation. It is made of anti-static PP and is suitable for chip tray packaging of COG, WLCSP, and other packaging types.
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