Material Properties (HIPS + Conductive Material)：
- Conductivity: By adding conductive materials, the surface resistance is typically in the range of 10³ to 10⁶ Ω/sq (ohms per square), which can effectively dissipate static electricity.
- Mechanical strength: HIPS material has excellent impact resistance, which can protect the chip from damage during transportation and handling.
- Molding technology: Injection molding.
Common Application：
- IC packaging and testing: Used to carry IC chips selected from the later stages of manufacturing and to transfer them between packaging equipment.
- COG process: This type of carrier tray is commonly used in the chip-on-glass process.
- Precision component packaging: Protects components such as semiconductor wafers and sensors that are susceptible to static electricity.
Features and Benefits：
- ESD protection: Carbon black material prevents static electricity buildup.
- High precision: The structure is precise and can be well matched with the packaging machine.