Company Profile

UTYC Technology — Driving Semiconductor Carrier Innovation Through Precision Manufacturing and R&D Excellence

Founded in 1982, UTYC Technology Co., Ltd. has cultivated over 40 years of expertise in precision mold development and injection molding technology. With 44 years of accumulated R&D capabilities and production experience, UTYC has grown into a leading enterprise with a capital of NT$200 million and a professional team of 135 employees.

To provide customers with more stable production capacity and technical services, we have established a dual-facility production system in Tainan with a total area of 15,000 square meters, including the 7,000 square meter Wanli Plant and the 8,000 square meter Xinchi Plant.

In product service, we specialize in providing display manufacturing carriers and process materials, including anti-static Chip Trays for display driver IC COG, anti-static ABS Reels for COF, anti-static Emboss Spacers, heat-resistant Spacers, and PI Leader Tapes.
In product development, we provide solutions for microchip tray in semiconductor application. 
We also provide comprehensive precision mold manufacturing services, committed to driving industry technology upgrades through exceptional quality.

Headquarters

Xinchi Plant

Our History

1982

UTYC Technology was established in Tainan, collaborating with Japanese company RCA to develop various television components.

1995

Developed molds and molding for various plastic components of VHS/Sony Beta videotapes.

1990

Developed 3.5-inch floppy disk molds and plastic molding.

1992

Collaborated with 3M to develop Data Cartridge plastic component molds and injection molding.

1994

Collaborated with American company E.P.T. (U.S.A.) to develop various medical device components.

1996

Developed I.C. Hard Tray and Chip Tray.

1998

Developed CD Case mold and injection molding with 8-cavity mold and 5-second cycle time.

1999

Obtained ISO-9002 certification and received PHILIPS Silver Award in the same year.

2000

Developed IC Card / Smart Card molds and injection molding.

2002

Developed various TFT-LCD plastic component molds and injection molding.

2003

Developed SD Card / MMC Card.

2004

Developed various precision plastic gears.

2006

Developed ABS Reel for COF applications.

2007

Invested in Ching Tsai Industrial Co., Ltd., developing spacer protection tape for COF applications.

2012

Invested in CCBio Technology Co., Ltd., researching and developing drug delivery system design and manufacturing.

2025

Developed heat-resistant protection tape for COF applications, and high-precision microchip tray with major Japanese passive component manufacturers.

2026

Ching Tsai Industrial Co., Ltd. merged into UTYC Technology, and developed high-precision microchip tray with Taiwanese and American optical communication customers.

2027

Planning to officially list on the OTC market in 2027, marking a new milestone towards sustainable business operations.

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