Main functions：
- Process guidance: In automated production lines, guiding wafer assemblies (such as COF) into packaging equipment.
- Support and Positioning: Ensures the wafer is accurately positioned on the COF and provides temporary support.
- Insulation and Protection: Because PI material has high insulation properties, it can effectively isolate current.
- High temperature resistance: The PI guide band can withstand the high temperatures during the packaging process.
Main application areas：
- COF Packaging: The carrier in the packaging process of display driver ICs and flexible printed circuit boards (COF).
- Semiconductor Packaging: Process guiding for Smart Card Chips.
- Automated equipment: Roll-to-roll production line.